3D-Printed Multi-Layer PCBs: Evaluating the Structural Integrity and Electromagnetic Compatibility of Additively Manufactured Circuits. International Journal of Engineering and Computer Science, india, v. 14, n. 06, p. 27258–27270, 2025. DOI: 10.18535/ijecs.v14i06.5158. Disponível em: https://ijecs.in/index.php/ijecs/article/view/5158. Acesso em: 5 dec. 2025.